NASAS was formed as the first Alliance completely dedicated to US expansion and reshoring of semiconductor packaging, assembly, & testing.
NASAS.us was formed in January 2022, following months of review on major Government Initiatives and Funding related to National Security.
Billions of dollars allocated for Semiconductor “Chip” Fabrication in US, however, minimal funding for the “Packaging” of Chips, ( chips into initial parts ) noting less than 3% is done in the US.
High visibility with Government Agencies and Companies to Fund the critical areas of Packaging, Assembly, Testing and the Package Materials to build US capabilities for National Security.
NASAS is positioned as a resource to develop the alliances between contacts and companies at the grass-roots level, to showcase the US capabilities and experience that are available.
“The International Symposium on MicroElectronics"
“Strategies to Revitalize On-Shore Packaging Base”
“Counterfeit Electronic Components Symposium”
“Defense and Commercial Sensing Technologies”